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Signal Integrity

From High Speed to Radiofrequency Applications

Fabien Ndagijimana, IMEP–LAHC, Grenoble, France

ISBN: 9781848215504

Publication Date: May 2014   Hardback   176 pp.

95.00 USD

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Presenting the concepts necessary for the design and testing of radiofrequency and high-speed circuits, this book explores signal and propagation theory for various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals, radiofrequency signals and supply circuits is developed in order to provide design rules for engineers and Masters-level students – it can also serve as basic training for technicians or engineers wishing to approach the design of high-speed circuits, or mixed digital and radiofrequency systems.
The first chapter is dedicated to the reduction of the rise time of digital signals linked to transmission in a limited-bandwidth channel and the effect on the parameters of the digital signal. Chapter 2 addresses the modeling basics of interconnects for high-speed applications. The third chapter introduces controlled impedance, mismatching, and the various reflections associated with them when signal frequencies increase. Chapter 4 discusses the concept of transmission lines, which are necessary for handling controlled-impedance interconnects. Chapter 5 introduces the concept of S parameters, used to determine circuit and system performances in the frequency domain. Chapter 6 addresses techniques of time-domain measurement via time-domain reflectometry (TDR). Finally, Chapter 7 introduces the phenomenon of coupling as the source of interference and crosstalk in packages and data buses.


1. Degradation of Rise Time in Interconnects.
2. Electromagnetic Modeling of Interconnects.
3. Controlled Impedance Interconnects.
4. Propagation on Transmission Lines.
5. The S-Parameters Testing Technique.
6. Time-Domain Reflectometry Analysis.
7. Interference and Cross-Talk in Interconnects.

About the Authors

Fabien Ndagijimana is currently Professor at University Joseph Fourier in Grenoble, France, where his research work has involved the development of electromagnetic modeling tools (TLM method) and their application to interconnects in radiofrequency and high-speed circuits. His current research interests include electromagnetic compatibility, propagation of radiofrequency electromagnetic waves in complex media and applications to bio-electromagnetic interactions for health and the environment.


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